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"...offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity."
—Jake Buurma, Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc.
- Covers signal integrity effects in high performance Radio Frequency (RF) IC
- Brings together research papers from the past few years that address the broad range of issues faced by IC designers and CAD managers now and in the future
A Wiley-IEEE Press publication
- Sales Rank: #6308447 in Books
- Published on: 2001-12-12
- Original language: English
- Number of items: 1
- Dimensions: 11.18" h x 1.06" w x 8.70" l, 2.81 pounds
- Binding: Hardcover
- 472 pages
Review
"In the era of System-on-Chip, when large portions of the overall system are integrated on one large chip, designers are facing increasingly challenging issues. For the first time, this book is taking a closer look at the signal integrity problems faced by both high-performance and cost-performance applications, digital and mixed-signal integrated circuits. System designers are given guidance in power distribution analysis, interconnect optimization, and mixed, digital-analog circuit integration challenges. Researchers and CAD engineers can get an in-depth view of the current and future requirements for full-chip CAD tools, on-chip transmission line designs, integrated passive components, and many other critical signal integrity issues. This book is bringing together a broad range of representative papers that will further the understanding both in the industrial and academic communities."
(Alina Deutsch, Research Staff Member, T.J. Watson Research Center, International Business Machines)
"Electrical integrity (or environment noise) is becoming the principal obstacle in system-on-a-chip design. Digital circuits create a very noisy environment in which other digital and analog circuits must function. This environmental noise comes about because of coupling through the interconnect, power supply, and substrate. This book surveys the latest literature on electrical integrity analysis and design and is, therefore, an invaluable resource for anyone designing systems-on-a-chip."
(Kenneth L. Shepard, Professor, Columbia University)
"The explosion of wireless communications that offer greater mobility and broadband communications that provide super fast access to the Internet have placed new demands on IC designers. The key to developing successful Systems on Chip designs that offer Analog and Mixed Signal capabilities is the approach used to extract and analyze the affects of parasitics on signal integrity. This book offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity."
(Jake Buurma Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc.)
"As technology scales to .1 micron and below, second order effects due to physical phenomena that were not much visible before start playing a more and more significant role. So much so that well-established methodologies and tools are not providing the necessary level of confidence to the designer that her/his integrated circuit will perform as planned. The need for more accurate extraction and analysis is obvious when we observe horror stories about very hard to detect intermittent faults created by interactions among signals on different wires. There are two complementary approaches to the problem that come to mind as always when we go over the limit of previous methods - increase the accuracy of the analysis tools, and/or solve the problems by imposing constraints on the degrees of freedom left to the designer. This collection of papers covers both in details. It is the most comprehensive syllabus of important results for researchers and designers on the topic. I highly recommend to read it and to pay attention to the messages given by the papers of the collection."
(Alberto Sangiovanni-Vincentelli, Professor, University of California Berkeley)
From the Publisher
"In the era of System-on-Chip, when large portions of the overall system are integrated on one large chip, designers are facing increasingly challenging issues. For the first time, this book is taking a closer look at the signal integrity problems faced by both high-performance and cost-performance applications, digital and mixed-signal integrated circuits. System designers are given guidance in power distribution analysis, interconnect optimization, and mixed, digital-analog circuit integration challenges. Researchers and CAD engineers can get an in-depth view of the current and future requirements for full-chip CAD tools, on-chip transmission line designs, integrated passive components, and many other critical signal integrity issues. This book is bringing together a broad range of representative papers that will further the understanding both in the industrial and academic communities." (Alina Deutsch, Research Staff Member, T.J. Watson Research Center, International Business Machines)
"Electrical integrity (or environment noise) is becoming the principal obstacle in system-on-a-chip design. Digital circuits create a very noisy environment in which other digital and analog circuits must function. This environmental noise comes about because of coupling through the interconnect, power supply, and substrate. This book surveys the latest literature on electrical integrity analysis and design and is, therefore, an invaluable resource for anyone designing systems-on-a-chip." (Kenneth L. Shepard, Professor, Columbia University)
"The explosion of wireless communications that offer greater mobility and broadband communications that provide super fast access to the Internet have placed new demands on IC designers. The key to developing successful Systems on Chip designs that offer Analog and Mixed Signal capabilities is the approach used to extract and analyze the affects of parasitics on signal integrity. This book offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity." (Jake Buurma Senior Vice President, Worldwide Research & Development, Cadence Design Systems, Inc.)
"As technology scales to .1 micron and below, second order effects due to physical phenomena that were not much visible before start playing a more and more significant role. So much so that well-established methodologies and tools are not providing the necessary level of confidence to the designer that her/his integrated circuit will perform as planned. The need for more accurate extraction and analysis is obvious when we observe horror stories about very hard to detect intermittent faults created by interactions among signals on different wires. There are two complementary approaches to the problem that come to mind as always when we go over the limit of previous methods - increase the accuracy of the analysis tools, and/or solve the problems by imposing constraints on the degrees of freedom left to the designer. This collection of papers covers both in details. It is the most comprehensive syllabus of important results for researchers and designers on the topic. I highly recommend to read it and to pay attention to the messages given by the papers of the collection." (Alberto Sangiovanni-Vincentelli,Professor, University of California Berkeley)
"Even as recently as 1990, most integrated circuit professionals dismissed growing concerns about interconnect-related problems as unnecessarily alarmist. But now that the 21st century has begun, design tool developers are desperate for strategies to deal with an onslaught of interconnect issues. Signal crosstalk is degrading performance, wire inductance is impeding power distribution, and substrate noise is interfering with sensitive analog circuits. The Editor has gathered together a collection of papers, both tutorial and advanced, that address a broad range of interconnect problems. And the reader will benefit seeing the interconnect problem from the design, extraction, analysis and synthesis points of view."(Jacob White, Professor, Massachusetts Institute of Technology)
From the Back Cover
Praise for Signal Integrity Effects in Custom IC and ASIC Designs
"For the first time, this book is taking a closer look at the signal integrity problems faced by both high-performance and cost-performance applications, digital and mixed-signal integrated circuits."
-Alina Deutsch, Research Staff Member
T.J. Watson Research Center, International Business Machines
"This book surveys the latest literature on electrical integrity analysis and design and is, therefore, an invaluable resource for anyone designing systems-on-a-chip."
-Kenneth L. Shepard, Professor
Columbia University
"This book offers a tutorial guide to IC designers who want to move to the next level of chip design by unlocking the secrets of signal integrity."
-Jake Buurma, Senior Vice President
Worldwide Research & Development, Cadence Design Systems, Inc.
"This collection of papers . . . is the most comprehensive syllabus of important results for researchers and designers on the topic. I highly recommend to read it and to pay attention to the messages given by the papers of the collection."
-Alberto Sangiovanni-Vincentelli, Professor
University of California Berkeley
"The editor has gathered together a collection of papers, both tutorial and advanced, that address a broad range of interconnect problems."
-Jacob White, Professor
Massachusetts Institute of Technology
Signal Integrity Effects in Custom IC and ASIC Designs compiles recent expert research papers in state-of-the-art IC (Integrated Circuits) design. It offers a detailed focus on all the major topics in understanding and modeling real-world IC signal integrity issues for CAD and IC design engineers, as well as graduate engineering students.
Practical, in-depth discussion of interconnect effects, inductance effects, power grid and distribution noise, and substrate noise and coupling is included. This specialized coverage provides the knowledge necessary to overcome serious problems in new, more complicated IC designs, such as:
* Wired and wireless communications ICs
* Large custom analog mixed-signal ICs
* ASIC designs from 0.12 microns and above
* Integrated custom IC blocks in ASIC (Applications-Specific Integrated Circuit) designs
Most helpful customer reviews
2 of 3 people found the following review helpful.
Never Seen Anything Like This Before
By Amazon Customer
Finally someone scours existing literature, gets permission to reprint some similar articles, and publishes them all in a book. Imagine the hours and hours spent entering search phrases. And here is the result of all that work. Zounds consort!
Isolate your noisy stuff from your quiet stuff with whatever trenches or diffusions you can find in the crummy ... process you are stuck using, work on your various rejection ratios, pray for luck, hope your stock options become worth something someday, and spend the price of this book on beer and doughnuts.
0 of 0 people found the following review helpful.
Wow - so interesting - compelling reading
By A Customer
Wow guys - amazing stuff here. I work as a Rail Inspection Officer here in the US and was looking for a book on SIGNAL INTEGRITY but i bought this by mistake. It so happens I also have a passing interest in CAD engineering and instead of returning this book i decided to read it and found it so amazing! Now i dont even touch my DVD collection or waste time playing baseball at the beach.
I recommend this book to Rail Inspection Employees and everyone else too!
2 of 4 people found the following review helpful.
A definite read for engineers
By A Customer
I found this good for students, designers, and CAD folks. Very good coverage of all the Signal Integrity/Noise topics needed in IC design from tutorial to expert.
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